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Mohammed Taha Ababneh

by Webdesigner last modified 2014-08-16 23:47

Curriculum Vitae


Personal Information

§ Name: Mohammed Taha Ababneh
§ Place of Birth: Irbid - Jordan 
§ Address: University of Cincinnati
Department of Mechanical Engineering
Micro-scale Heat Transfer Lab.
Old Chemestry 517-B.
§ E-mail:ababnemt@mail.uc.edu
§             mohammed.ababneh@1-act.com

 

Education

Ph.D., Mechanical Engineering,

University of Cincinnati, 2012.

o   Dissertation title: "Novel Charging Station and Computational Modeling for High Thermal Conductivity Heat Pipe Thermal Ground Planes"

 

M. S., Mechanical Engineering,

JUST University, 2007.

o   Thesis title: “Heat Transfer Optimization and Entropy Generation Minimization to a Non-Spherical Drop Suspended in an Electric Field

 

B.Sc., Mechanical Engineering,

JUST University, 2005.

o   Project title: "Heating System for Poultry House Using Fluidized Bed Boiler"

 

Publications

  • Journals

 

1.     Ababneh, M.T., Chauhan, S.S. et. al, 2012, “Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane”. Journal of Heat Transfer 135, 021401. 

2.     Ababneh, M.T., Gerner, F.M. et. al, “Thermal-Fluid Modeling for High Thermal Conductivity Heat Pipe Thermal Ground Planes”. Journal of Thermophysics and Heat Transfer (accepted).

3.     Chauhan, S., Chamarthy, P., King, W.H., Deng, T., Ababneh, M.T., Gerner, F.M., “Charging and Fill Volume Optimization of miniature high performance heat pipes”. International Journal of Heat and Mass Transfer (submitted).

4.     Ababneh, M.T., Gerner, F.M. et. al, “Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes”. Journal of Heat Transfer (submitted).

5.     Ababneh, M.T., Gerner, F.M. “Fluid Flow and Capillary Limit in Heat Pipe Thermal Ground Planes”. Journal of Thermophysics and Heat Transfer (submitted).

 

  • Conferences

1.     Gerner, F.M., Ababneh, M.T., “Micro-scale Heat Transfer and MEMS – Based Microelectronics Cooling Devices,” DARPA Kick-off Meeting, April 18, 2008, Niskayuna, New York.

2.     Varanasi, K.K., et al., “DARPA Thermal Ground Plane (TGP) Engineered Nanostructures for High Thermal conductivity TGP Substrates,” DARPA MEMS PI Review Meeting, July 23-25, 2008, Vail, Colorado.

3.     Gerner, F.M., Ababneh, M.T., 2008 “Recent Advances in Micro-Miniature Heat Pipes and Loop Heat Pipes for Electronics Cooling,” 6th International Energy Conversion Engineering Conference, July 28-30, 2008, Cleveland, Ohio.

4.     Ababneh, M.T., et al., “Charging Station for DARPA Thermal Ground Plane,” 34th Dayton-Cincinnati Aerospace Sciences Symposium, March 3, 2009, Dayton, Ohio.

5.     Ababneh, M.T., et al., “Charging Unit for Engineered Nanostructures for TGP Substrates,” 35th Dayton-Cincinnati Aerospace Sciences Symposium, March 9, 2010, Dayton, Ohio.

6.     Tao Deng et al., “Thermal Ground Plane” Thermal Management Technologies, DARPA PI Meeting, March 9-12, 2010, Marco Island, Florida.

7.     De Bock, H.P.J., Chauhan, S., Chamarthy, P., Weaver, S.E., Deng, T., Gerner, F.M., Ababneh M.T., Varanasi, K., 2010, "On the Charging and Thermal Characterization of a Micro/Nano Structured Thermal Ground Plane," Itherm 2010 (in proceedings), Las Vegas, NV.

8.     Peter deBock, Shakti Chauhan, Pramod Chamarthy, Stanton Weaver, Tao Deng, Frank Gerner, Mohammed Ababneh and Kripa Varanasi, “On the Charging and Thermal Characterization of Micro/Nano Structured Thermal Ground Plane,” GE Technical Information Series, 2010 GRC 366, April 2010.

9.     Ababneh, M.T., Gerner, F.M. et al., 2011, “Charging Station of a Planar Miniature Thermal Ground Plane,” Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference, March 13-17, 2011, Honolulu, Hawaii, USA.

10.  Ababneh, M.T., Gerner, F.M. et al 2012, “Thermo-fluid Model for High Thermal Conductivity Thermal Ground Planes,” Proceedings of the ASME 2012 3rd Micro/Nanoscale Heat & Mass Transfer International Conference, March 3-6, 2012, Atlanta, GA, USA.

11.  Ababneh, M.T., Chamarthy, P., et. al 2012, “Thermal Modeling for High Thermal Conductivity Thermal Ground Planes,” Proceedings of the Proceedings of the ASME 2012 Summer Heat Transfer Conference HT 2012 , July 8-12, 2012, Rio Grande, Puerto Rico.

12.  Ababneh, M.T., Gerner, F.M. 2013, “Fluid Flow and Capillary Limit in Heat Pipe Thermal Ground Planes” ASME 2013 Summer Heat Transfer Conference HT 2013, July 14-19, Minneapolis, MN, USA.

13.  Ababneh, M.T., Gerner, F.M. 2013, “Non-dimensional Analysis for the Fluid Flow in the Flat Heat Pipes” ASME 2013 Summer Heat Transfer Conference HT 2013, July 14-19, Minneapolis, MN, USA.

14.  Chauhan, S.S., De Bock, H.P.J., Kim, J. H., Miller S., Labhart J., Gerner, F.M. , Ababneh, M.T., 2013, “ DARPA Thermal Ground Plane” Thermal Ground Plane Workshop, U.S. Army Research Laboratory, September 19, Adelphi, Maryland, USA.

Relevant Experience

  • Research and Development Engineer in the Aerospace/Defense Group, Advanced Cooling Technologies, Inc. (ACT): December 2013 – Present.
  • Postdoctoral Researcher, Heat transfer and CFD, Procter & Gamble (P&G) Company - UC Modeling and Simulation Center: April 2012 – December 2013.
  • Editor, Scientific Journal of Microelectronics (SJM): April 2013 – Present.
  • Research and Teaching Assistant, Micro-scale Heat Transfer Laboratory, University of Cincinnati: April 2008 – April 2012.
  • Intern, Thermal System Lab, General Electric Global Research Center, Niskayuna, NY: June 2010 – September 2010.
  • Intern, Device Integration Lab at General Electric Global Research Center, Niskayuna, NY: August 2008 – October 2008.
  •  Part-time instructor, College of Engineering at JUST University: October 2007 – January 2008.
  • Teaching assistant, JUST University: October 2005 – August 2007.
  •  Worked in a Program of engineering Training in Irbid Directorate for public works: September 2005 – September 2006.
  • Participant, TEMPUS project for renewable energy applications and efficiency, KTH, Stockholm: June 2005.

 

Skill highlights

§  In-depth knowledge of heat transfer, fluids, two-phase flow, thermodynamics and heat pipes.

 

§  Experienced with commercial software packages, including: AcuSolve, EnSight, ABAQUS, COMSOL, Flow3D, and ANSYS Workbench: ANSYS Icepak, ANSYS FLUENT, ANSYS Thermal Analysis and ANSYS CFX.

 

§  Experienced with self-written computer codes in C++, EES, and MATLAB.

 

§  Experienced in utilizing High Performance Computing (HPC) Clusters for CAE/CFD simulations for both Linux and Windows.

 

§  Rig design and fabrication experience (for example, Charging Station for DARPA Thermal Ground Plane).

 

§  Experience with thermal management systems (for example, Worked with GE machine cooling team in mid-to-large size electric machines like generator’s cooling for 5 MW wind turbines project).

 

§  Mechanical design experience with AutoCAD, SolidWorks, and Solid Edge.

 

§  Experience with fundamental approach to understanding process setting in thermal bonding for nonwoven fibers in pampers diapers; internal flow modeling and design for Nozzles; CFD simulations of splash losses of a tray filling; CFD simulations for air filtering devices. 

 

§  Skilled in instrumentation and data acquisition with LabView.

 

§  Excellent communications and problem solving skills.