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Title: Engineered Nanostructures for High Thermal Conductivity Substrates. Total fund: $6,000,000. Year: Starting 2008. Duration: 3 years. Funding Agent: DARPA & General Electric Global Research Center. Description: Modeling, fabrication,testing and experimental for high thermal conductive substrate with engineered nanostructures heat pipe wick.

 Title   Author   Type   Modified 
Loop Heat Pipe Webdesigner Page 2009-04-07 10:53
Interfacial Phenomena Webdesigner Page 2009-04-07 10:54
Sponsors Webdesigner Page 2009-07-07 18:10
Thermal Ground Plane Mohammed Taha Ababneh Page 2009-07-07 18:08