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Thermal Ground Plane

by Mohammed Taha Ababneh last modified 2009-07-07 18:08

Title: Engineered Nanostructures for High Thermal Conductivity Substrates.

Total fund: $6,000,000.

Year: Starting 2008.

Duration: 3 years.

Funding Agent: DARPA & General Electric Global Research Center.

Description:  Modeling, fabrication,testing and experimental for high thermal conductive substrate with engineered nanostructures heat pipe wick.